cmzb68~cmzb390 2011-06-20 1 toshiba zener diode silicon junction cmzb68~cmzb390 communication, control and measurement equipment constant voltage regulation ? power dissipation: p = 1.0 w ? zener voltage: v z = 68 to 390 v ? suitable for high-density board a ssembly due to the use of a small surface-mount package, m ? flat tm absolute maximum ratings (ta = 25c) characteristics symbol rating unit power dissipation p 1.0 (note 1) w junction temperature t j 150 c storage temperature range t stg ? 55 to 150 c note : using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature / current / voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and met hods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: ta = 40c device mounted on a glass-epoxy board board size: 50 mm 50 mm land pattern: 6 mm 6 mm board thickness: 1.6 mm land pattern dimensions for reference only unit: mm anode cathode 0.16 0.65 0.2 0.65 0.2 4.7 0.2 3.8 0.1 0 ~ 0.1 0.98 0.1 1.75 0.1 + 0.2 ? 0.1 2.4 jedec D jeita D toshiba 3-4e1a weight: 0.023 g (typ.) 3.0 1.4 2.1 unit: mm 1.4
cmzb68~cmzb390 2011-06-20 2 electrical characteristics (ta = 25c) marking abbreviation code part no. abbreviation code part no. b68 cmzb68 b2a cmzb200 b75 cmzb75 b2c cmzb220 b82 cmzb82 b2e cmzb240 b1a CMZB100 b2h cmzb270 b1b cmzb110 b3a cmzb300 b1f cmzb150 b3d cmzb330 b1j cmzb180 b3k cmzb390 zener voltage vz (v) dynamic resistance r d ( ) temperature coefficient forward voltage v f (v) reverse current i r ( a) t (mv/c) type min typ. max measure- ment current i z (ma) max measure- ment current i z (ma) typ. max max measure- ment current i f (a) max measure- ment voltage v r (v) cmzb68 61.2 68 74.8 4 120 4 57 90 1.2 0.2 10 54.4 cmzb75 67.5 75 82.5 4 150 4 66 104 1.2 0.2 10 60 cmzb82 73.8 82 90.2 3 170 3 71 113 1.2 0.2 10 65.6 CMZB100 90 100 110 3 300 3 87 138 1.2 0.2 10 80 cmzb110 99 110 121 3 300 3 96 152 1.2 0.2 10 88 cmzb150 135 150 165 2 450 2 136 210 1.2 0.2 10 120 cmzb180 162 180 198 1.5 500 1.5 161 254 1.2 0.2 10 144 cmzb200 180 200 220 1.5 500 1.5 170 269 1.2 0.2 10 160 cmzb220 198 220 242 0.5 5000 0.5 200 309 1.2 0.2 10 176 cmzb240 216 240 264 0.5 5000 0.5 215 343 1.2 0.2 10 192 cmzb270 243 270 297 0.5 5000 0.5 243 385 1.2 0.2 10 216 cmzb300 270 300 330 0.5 5000 0.5 270 428 1.2 0.2 10 240 cmzb330 297 330 363 0.5 5000 0.5 296 473 1.2 0.2 10 264 cmzb390 351 390 429 0.5 10000 0.5 350 555 1.2 0.2 10 312
cmzb68~cmzb390 2011-06-20 3 handling precaution 1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a moment. do not exceed any of these ratings. th e following are the general derating methods that we recommend when you design a circuit with a device. p: we recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipa tion. carry out adequate heat design. p rsm: we recommend that a device be used within the recommended area in the figure, p rsm -tw. t j : derate this rating when using a devi ce in order to ensure high reliability. we recommend that the device be used at t j of below 120c. 2) thermal resistance between junction and ambient fluc tuates depending on the device?s mounting condition. when using a device, design a circuit board and a land pattern to match the appropriate thermal resistance value. 3) please refer to the rectifiers databook for further information.
cmzb68~cmzb390 2011-06-20 4 0 0.2 0 80 160 0.4 0.6 0.8 1.0 1.2 40 120 ta m a x ? p maximum allowable temperature ta m a x ( c ) power dissipation p (w) device mounted on a glass-epoxy board: board size: 50 mm 50 mm land pattern: 6.0 mm 6.0 mm board thickness: 1.6 mm 0.001 1000 10 0.1 100 1000 10 0.01 0.1 1 100 1 r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) time t (s) device mounted on a ceramic board: board size: 50 mm 50 mm land pattern: 2.0 mm 2.0 mm board thickness: 0.64 mm device mounted on a glass-epoxy board: board size: 50 mm 50 mm land pattern: 6.0 mm 6.0 mm board thickness: 1.6 mm device mounted on a glass-epoxy board: board size: 50 mm 50 mm land pattern: 2.1 mm 1.4 mm board thickness: 1.6 mm 10 100 1000 110 p rsm ? t w (reference value) non-repetitive peak reverse power dissipation p rsm (w) pulse width t w (ms) recommended ta = 25c rectan g ular p ulse p rsm t w 0.1 0 400 200 0 350 400 250 50 100 150 250 50 150 300 350 t ? v z (typ.) temperature coefficient of zener voltage t (mv/c) zener voltage v z (v) 100 200 300
cmzb68~cmzb390 2011-06-20 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
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